Advanced packaging materials
NanoSiN commercializes nanoporous silicon nitride (NPSN) — a defense-validated ceramic interlayer engineered to manage heat, stress, and signal integrity inside the package.
Talk to us See the materialThe problem
AI and HPC packages now place optical engines millimeters from compute silicon, and every watt, every micron of mismatch, and every decibel of loss is paid inside the package. Conventional substrate and interlayer materials force engineers to trade thermal performance against mechanical reliability against signal integrity.
NPSN was engineered so they don't have to. Its nanoscale porosity moves four package-level problems at once.
Heat density at the package level disrupts neighboring optical and compute components. NPSN provides a controlled thermal path where it is needed — and isolation where it is not.
Dissimilar materials expand at different rates across thermal cycles. The porous architecture accommodates strain that dense ceramics transmit.
At co-packaged signaling rates, substrate loss budgets collapse. Porosity lowers the effective dielectric constant and loss of the interlayer.
Bonding compound-semiconductor lasers to silicon concentrates stress at the interface. A compliant interlayer protects the most fragile component in the stack.
The material
NPSN is a nanoporous silicon nitride interlayer: a ceramic whose pore structure is engineered at the nanoscale, not an adapted bulk material. Each property maps directly to a package-level result.
Pore architecture sets the thermal path — conduction where the design needs it, isolation where it doesn't.
The porous network absorbs CTE-driven stress across thermal cycles, protecting bonds and interfaces.
Lower effective permittivity preserves signal integrity at co-packaged data rates.
Full material data is available under NDA. Request the technical package →
Where it sits
NPSN sits between the components that generate heat and stress and the components that can't tolerate them — the interface layer in a co-packaged optics stack where thermal, mechanical, and electrical budgets collide.
Provenance
NanoSiN is a spin-off of American Technical Coatings, a Westlake, Ohio ceramics manufacturer. NPSN was developed and validated in demanding defense applications before being brought to semiconductor packaging — the company commercializes a material that already exists, made by people who already make it.
Built on an institutional governance framework from day one — structured for technical partners, investors, and the long term.
Contact
Tell us about the stack. Technical data, samples, and evaluation discussions begin with a conversation.
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